Realme to deliver the first Dimensity 810 smartphone
MediaTek today announced the Dimensity 810 SoC, and it looks like Realme will be the first brand to launch a device powered by that chipset.
Realme India and Europe’s CEO, Mr. Madhav Sheth, retweeted MediaTek’s post about the Dimensity 810 and asked if customers and fans would like the phone maker to be the first to bring a Dimensity 810-powered device to the market, basically calling dibs on the Taiwanese company’s freshly announced chip.
Do you want #realme to be the first to bring MediaTek Dimensity 810 Processor in the world? https://t.co/RVcrsnzvE5— Madhav Sheth (@MadhavSheth1)…
The Samsung Unpacked event brought us the Galaxy Z Flip3 and Z Fold3 smartphones with water resistance and flagship chipsets. The Galaxy Watch4 series followed them on stage and the event was wrapped up by the new TWS earphones Galaxy Buds2.
The Samsung Unpacked event is over, and we saw the arrival of two new foldable smartphones in the Galaxy Z Fold3 and Z Flip3, two Galaxy Watch4 smartwatches and new TWS earbuds, Galaxy Buds2.
Say hello to the Galaxy Watch4 and Galaxy Watch4 Classic smartwatches – Samsung’s first wearables with One UI Watch, based on Wear OS. These devices come with a fashion-forward design and a host of sensors, but most importantly the first 5nm chipsets on Wear OS.
Alongside its new foldable flagships Samsung announced the Galaxy Buds2 – its lightest TWS earphones to date. They bring a new design and active noise cancellation enabled by the three microphones per bud.
The Samsung Galaxy Z Flip3 clamshell is the second foldable phone to debut at today’s unpacked event. It comes with a new design and improvements to both screens, plus an official IPX8 rating for water resistance, much like the Galaxy Fold3 that shared the stage with it.