Tech News For Today

Samsung adds third-party wallet support to its Blockchain Wallet

Little known fact is that Samsung has a native crypto wallet for its Galaxy smartphones and starting today, the so-called Samsung Blockchain Wallet will support third-party wallets and cold wallet storages so you can manage your crypto assets from one place.

Samsung’s wallet can now connect to hardware wallets like Ledger Nano S and Nano X. Keep in mind, though, that Samsung’s wallet support for tokens is still limited to Bitcoin, Etherium, ERC20 tokens, Tron and TRC tokens. In addition, the wallet supports decentralized apps built on blockchain to authenticate and exchange assets on…

Oppo Reno6 Pro+ specs confirmed yet again, will feature X-axis linear motor

The Reno6 Pro and Reno6 Pro+ are expected to arrive as the latest additions to Oppo’s product lineup. We’ve already seen the pair in TENAA listing and a leaked spec sheet and now we get more details surrounding the Pro+ and its camera setup

Well-known tipster DigitalChatStation confirmed via his Weibo profile that the Reno6 Pro+ will carry a Snapdragon 870 chipset alongside a 4,500 mAh battery with 65W SuperVOOC charging and Sony’s 50MP IMX766 camera sensor. The handset is said to measure in at 7.99mm thick while weighing in at 188 grams.

DigitalChatStation post on Weibo

This…

Reuters: TSMC may build its advanced 3nm foundry in the US instead of Europe

Building more semiconductor foundries in the midst of a global chip shortage sounds like great news. However, it’s a very expensive process that takes years, which is made clear in a report from Reuters about TSMC’s plans to built more factories.

Last year it announced a $10-12 billion investment to build one chip factory in Phoenix, Arizona (first of up to six). It will be producing chips on a 5 nm process with a relatively low target of 20,000 12” wafers a month (compared to 100,000/month that the factories in Taiwan are churning out). Now the company’s leadership is considering a more…

Samsung Galaxy A22 4G and A22 5G renders and specs surface

The Samsung Galaxy A22 is reportedly due in June and it looks like it will come in two variants – 4G and 5G.

The two phones have a largely identical design and four colors – White, Black, Purple and Mint. Where they differ is in the cameras, displays, chipsets and biometrics.

The Galaxy A22 5G, seen below, will be powered by a MediaTek Dimensity 700 chipset with a 5G modem, have a 6.4-inch display, which given the visible side-mounted capacitive fingerprint scanner is likely an LCD.

There will be three cameras on the back of the Galaxy A22 5G – a 48MP main one, a 5MP (likely…

The vanilla Oppo Reno6 also makes an appearance on TENAA

After the Oppo Reno6 Pro and Pro+ showed up on TENAA, we now have the vanilla Reno6 listed as well. As a result we have some of the specs of the handset with model number PEQM00 confirmed.

Oppo Reno5 5G

The specs sheet says the regular Reno6 will sport a 6.43-inch display and a 4,200 mAh battery split into two cells to enable Oppo’s 65W fast charging tech. There were also dimensions on the listing – 158.8 x 72.1 x 7.59mm, which is a tad smaller than the current Reno5 5G with the same 6.43-inch display.

This is good news as we recently reviewed the Reno5 5G and it turned out to be a…

Dimensity 900-powered vivo smartphone pops up on Geekbench

Mediatek introduced the Dimensity 900 chipset for midrangers yesterday. The Taiwanese company stayed silent on an eventual phone launches with the new SoC, but vivo might be very quick to adopt it.

A device with the model number vivo V2123A appeared on Geekbench 4, and it is powered by the MT6877 chipset, also known as Dimensity 900. The results are 3,467 in the single core test and 8,852 for multiple cores.

vivo V2123A on Geekbench

Mind you these numbers are not comparable to those from the more recent GeekBench 5. It is quite hard to compare the performance of the Dimensity 900…

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